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Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

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  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production 和 flexible small-batch manufacturing.
  • 主要特點:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including 電子製造, automotive 和 consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision 和 speed in their SMT production lines, such as those in the electronics 和 automotive industries, as well as companies dealing with complex and fine-pitch components.
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技術規格 參數
対象電路板尺寸（L×W） 最大457mm×356mm
厚度 0.4（0.3）～5.0mm/MIN50mm×50mm
電路板載入時間 1.8秒
機器尺寸（長×寬×高） 1,500mm×1,607.5mm×1,419.5mm（搬運高度:900mm、除訊號塔）
機器重量 本機：1,500kg，MFU-40：約240kg（滿載W8供料器時），BTU-AII：約120kg，BTU-B：約15kg，MTU-AII：約615kg（滿載料盤、供料器） ）
吸嘴數 12（旋轉自動換頭）
自動換頭收藏數 2
對像元素 0402(01005)～20×20mm，高度MAX3.0mm
貼裝節拍 0.144秒/個，25,000cph
貼裝精度 小型晶片元件等±0.050mm cpk≧1.00～±0.066mm cpk≧1.33，QFP元件±0.040mm cpk≧1.00～±0.053mm cpk≧1.33

富士XPF貼片機的特點

自動更換貼裝工作頭：可以在中自動更換貼裝工作頭，實現了世界領先的自動更換工作頭。也可以自動更換塗敷膠著劑的工作頭，只需1台機器就可以進行塗敷膠著劑和貼裝元件。

消除高速機和多功能機的界限：透過實現自動更換工作頭，消除了高速機和多功能機的界限（無邊界）。

加工貼裝：小型晶片元件等±0.050mm cpk≧1.00～±0.066mm cpk≧1.33，QFP元件±0.040mm cpk≧1.00～±0.053mm cpk≧1.33。

高生產效率：貼裝節拍達0.144秒/個，25,000cph。

相容於多種元件：物件元件範圍廣泛，包括0402(01005)～20×20mm，高度MAX3.0mm的元件。靈活的元件封裝：支援料帶元件（JIS規格、JEITA）、料管元件、料盤元件等多種封裝形式。

富士XPF貼片機的應用領域

富士XPF貼片機主要評估表面貼裝技術（SMT）生產線，能夠高速、高精度、高精度地貼放各種電子元件，如晶片、電阻、電容、連接器等，具體應用領域包括但不限於僅限以下幾個方面：
消費性電子：如手機、平板電腦、筆記型電腦、數位相機等。
汽車電子：如汽車導航系統、汽車內裝、汽車安全系統等。
工業控制：如工業自動化設備、儀器、醫療器材等。
通訊設備：如路由器、交換器、基地台等。
航空航太：如衛星、飛機等航太設備。

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