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Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

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  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production 和 flexible small-batch manufacturing.
  • 主要特点:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including 电子制造业, automotive 和 consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision 和 speed in their SMT production lines, such as those in the electronics 和 automotive industries, as well as companies dealing with complex and fine-pitch components.
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技术规格 參數
対象电路板尺寸（L×W） 最大457毫米×356毫米
厚度 0.4（0.3）～5.0mm/MIN50mm×50mm
船上载入时间 1.8秒
机器尺寸（长×宽×高） 1,500mm×1,607.5mm×1,419.5mm（搬运高度:900mm、除信号塔）
重量 本机：1,500kg，MFU-40：约240kg（满载W8供料器时），BTU-AII：约120kg，BTU-B：约15kg，MTU-AII：约615kg（满载料盘、供料器寸） ）
吸嘴數 12（旋转自动更换头）
自动更换头数 2
物体元件 0402(01005)～20×20mm，高度MAX3.0mm
贴装节日拍 0.144秒/个，25,000cph
安装精度 小型芯片元件等±0.050mm cpk≧1.00～±0.066mm cpk≧1.33，QFP元件±0.040mm cpk≧1.00～±0.053mm cpk≧1.33

富士XPF 贴纸机

自动更换贴装工作头：可以在中自动更换贴装工作头，实现了世界领先的自动更换工作头。因为可以在机器运转中从高速工作头自动更换为多功能生产工作头，对所有元件可以始终以较佳工作头也可以自动更换涂敷胶着剂的工作头，只需1台机器就可以进行涂敷胶着剂和贴装元件。

消除高速机和多功能机的界限：通过实现自动更换工作头，消除了高速机和多功能机的界限（无边界）。对于所有电路板种类，因为机器间的平衡始终处于较优状态，所以可以扩大延长地发挥机器的能力。

高精度安装：小型芯片元件等±0.050mm cpk≧1.00～±0.066mm cpk≧1.33，QFP元件±0.040mm cpk≧1.00～±0.053mm cpk≧1.33。

生产力：贴装节拍达0.144秒/个，25,000cph。

兼容多种元件：对象元件范围广泛，包括0402(01005)～20×20mm，高度MAX3.0mm的元件。柔性包装：支持料带元件（JIS规格、JEITA）、料管元件、料盘元件等多种封装形式。

富士XPF贴片机的应用领域

富士XPF贴片机主要评估表面贴装技术（SMT）生产线，能够高速、高精度、高精度地贴放各种电子元件，如芯片、电阻、电容、连接器等，具体应用领域包括但不限于仅限以下几个方面：
消费电子：如手机、平板电脑、笔记本电脑、数码相机等。
汽车电子：如汽车导航系统、汽车内饰、汽车安全系统等。
工业控制：如工业自动化设备、仪器仪表、医疗器械等。
通信设备：如路由器、交换机、基站等。
飞机：如卫星、飞机等航空航天设备。

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