Siemens SIPLACE X4is High-Speed SMT Pick and Place Machine

$1.00

The Siemens SIPLACE X4is is an advanced SMT pick-and-place machine, engineered for high-speed, high-mix PCB assembly. Offering exceptional precision and flexibility, it is designed to handle a wide range of components, including small-pitch and 01005 components, making it ideal for complex electronic manufacturing environments.

  • Key Features:
    • Ultra-Fast Placement Speed: The SIPLACE X4is delivers record-breaking placement speeds, optimizing production for high-volume and high-mix applications.
    • Precision Placement: Equipped with a high-resolution camera and advanced nozzle technology, it ensures accurate component placement on fine-pitch PCBs.
    • Flexible Configuration: The X4is supports multiple gantry configurations, enabling users to easily adjust to diverse production needs.
    • Reduced Downtime: Automated features, such as auto-calibration and quick feeder changes, minimize downtime, ensuring continuous production.
    • High Component Flexibility: The X4is can handle a wide variety of components, from large packages to small 01005 components, meeting the needs of modern electronics manufacturers.
  • Applications: The Siemens SIPLACE X4is is perfect for high-volume production lines, specializing in consumer electronics, automotive electronics, and telecommunications equipment. Its flexibility also makes it suitable for companies engaged in medical device manufacturing, LED production, and more.
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参数 详情
贴装性能 悬臂数量:4
IPC 速度:125,000 cph
SIPLACE 基准评测:150,000 cph
理论速度:200,000 cph
机器尺寸:1.9 x 2.3 米
贴装头特性 元器件范围:公制 0201-6×6mm
贴装准确性:±36μm/3σ
角精度:±0.5°/3σ
最大元件高度:4mm
贴装力:1.3-4.5 牛顿
传送带特性 传送带类型:单轨、灵活双轨
传送带模式:异步、同步、独立贴装模式(X4iS)
PCB 格式:50 x 50mm 至 850 x 560mm(X4S、X3S、X2S);50 x 50mm 至 610 x 510mm(X4iS)
PCB 厚度:0.3-4.5mm(其他尺寸可根据要求定制)
PCB 重量:最大 3kg
元器件供应与供料 供料器容量:X4iS 为 148 个 8mm X 供料器模块
供料器模块类型:SIPLACE 元器件推车、SIPLACE 矩阵托盘供料器(MTC)、华夫盘托盘(WPC5/WPC6)、JTF-S/JTF-M SIPLACE X 供料器 Tray 盘、振动料管、振动供料器、定制 OEM 供料器模块
质量评级 拾取率:≥99.95%
DPM 速率:≤3dpm
照明等级:6 级照明度

Siemens SIPLACE X4is High-Speed SMT Pick and Place Machine

西门子 SIPLACE X4is的特点

  • 贴片速度快:理论速度可达200,000cph,能快速高效地完成贴片任务。
  • 贴装精度高:±36μm/3σ的贴装准确性和±0.5°/3σ的角度精度可以保证产品具有出色的质量。
  • 元件范围广:能处理公制0201-6×6mm的元器件,适应了各种不同元件的贴装需求。
  • 灵活性强:单轨和灵活双轨两种传送带模式可根据实际情况自由选择,从而提高生产效率。
  • 智能供料器:采用非接触式电源和数据传输,具备高精度、可靠且低维护要求的特点,降低了维护成本。

 

西门子 SIPLACE X4is的应用领域

消费电子,例如手机、平板电脑、智能手表等各类消费电子产品的电路板组装都会用到它。

计算机硬件,像台式电脑、笔记本电脑等产品的主板等组件的贴装工作。

通信设备,比如路由器、交换机等通信设备的制造过程。

汽车电子,可应用于汽车控制系统、车载娱乐系统等电子部件的生产。

工业控制,对工业自动化设备中电路板的高效贴装起到重要作用。

医疗器械,部分医疗电子设备的组装也会利用该贴片机。

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