The World’s First Hybrid AOI: TR7700 SII Plus
Utilizing a new hybrid inspection design, the TR7700 SII Plus can leverage both stop-and-go strategy and dynamic imaging to achieve optimal inspection performance on all types of PCBAs, e.g.: Inspection Cycle Time Reduction. Simply switch the inspection mode to determine the best approach for your product.
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• Flexible Stop-and-Go or Dynamic Imaging AOI
• Intelligent Easy Programming Interface
• Rapid Changeover with Intelligent Auto Conveyor
• Foreign Material and Extra Component Inspection
• 6 µm or 10 μm or 15 μm resolution
| Imaging Method | Dynamic Imaging or Stop-and-Go on select configurations |
| Top Camera | 4 or 9 or 12 Mpix high speed color camera (factory setting) |
| Angle Camera | N/A |
| Imaging Resolution | 6 µm, 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | N/A |
| Max. 3D Range | N/A |
| Imaging Speed | 4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec 4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec 9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec 12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec 4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec 4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 µm |
| Max PCB Size | TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm TR7700 SII Plus@ 6 µm: 400 x 400 mm TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 10 µm, 15 µm: 25 mm [48 mm optional◎※] 6 µm: 25 mm ◎The air blow module does not apply to this option ※This option is only available for 4 Mpix camera. |
| Bottom Clearance | 10 µm, 15 µm: 40 mm [100 mm optional] 6 µm: 40 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
| WxDxH | TR7700 SII Plus: 1000 x 1400 x 1650 mm TR7700 SII Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7700 SII Plus: 600 kg TR7700 SII Plus DL: 650 kg |
