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Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

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  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production и flexible small-batch manufacturing.
  • Основные характеристики:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including производство электроники, automotive и consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision и speed in their SMT production lines, such as those in the electronics и automotive industries, as well as companies dealing with complex and fine-pitch components.
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対象电路板尺寸(Д×Ш) МАКС457мм×356мм
Да 0,4（0,3）～5,0 мм/мин50 мм×50 мм
电路板载入时间 1.8сек
Размеры (Д×Ш×В) 1500×1607,5×1419,5 мм (размер: 900 мм).
机器重量 Вес: 1500 кг, MFU-40: 240 кг (W8 供料器时), BTU-AII: 120 кг, BTU-B: 15 кг, MTU-AII: 615 кг.供料器吋）
吸嘴数 12 (необходимо проверить)
自动更换收藏数 2
对象元件 0402(01005)～20×20 мм, диаметр MAX3,0 мм
贴装节拍 0,144 сек/ч, 25 000 циклов/ч
贴装精度 小型芯片元件等±0,050 мм cpk≥1,00～±0,066 мм cpk≥1,33, QFP元件±0,040 мм cpk≥1,00～±0,053 мм cpk≥1,33

富士 XPF 贴片机特点

自动更换贴装工作头:可以在生产中自动更换贴装工作头，实现了世界领先的自动更换工作头。因为可以在机器运转中从高速工作头自动更换为多功能工作头，对所有元件可以始终以较佳工作头进行贴装。也可以自动更换涂敷胶着剂的工作头，仅用 1 台机器就可以进行涂敷胶着剂和贴装元件。

消除高速机和多功能机的界限: 通过实现自动更换工作头，消除了高速机和多功能机的界限（无边界）。对于所有电路板种类，因为机器间的平衡始终处于较优状态，所以可以较大限度地发挥机器的能力。

高精度贴装: 小型芯片元件等±0,050 мм cpk≥1,00～±0,066 мм cpk≥1,33, QFP 元件±0,040 мм cpk≥1,00～±0,053 мм cpk≥1,33.

高生产效率Скорость: 0,144 с/час, 25 000 куб.см.

兼容多种元件: 对象元件范围广泛,包括 0402(01005)～20×20 мм, максимум 3,0 мм.灵活的元件包装:支持料带元件(JIS 规格、JEITA）、料管元件、料盘元件等多种包装形式).

XPF 贴片机的应用领域

XPF 贴片机主要应用于表面贴装技术（SMT）生产线, 能够高速、高精度、全自动地贴放各种电子元件,如芯片,电阻、电容、连接器等,具体应用领域包括但不限于以下几个方面:
消费电子:如手机、平板电脑、笔记本电脑、数码相机等。
汽车电子:如汽车导航系统、汽车音响、汽车安全系统等。
工业控制:如工业自动化设备、仪器仪表、医疗器械等。
通信设备:如路由器、交换机、基站等。
Переводчик Google如卫星、飞机等航空航天设备。

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