Siemens Siplace HS-50 Chip Shooter – High-Performance SMT Placement System

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  • Brand: Siemens
  • Model: Siplace HS-50
  • Type: SMT Chip Shooter (Pick and Place Machine)
  • Key Features:
    • High-Speed Placement: Designed for fast, high-precision placement of components on PCB assemblies, making it ideal for medium to high-volume production.
    • 4-Head System: Equipped with a robust 4-head configuration, offering flexibility and enhanced placement accuracy.
    • Versatile Component Handling: Supports a wide range of components, from small chips to larger components, making it suitable for diverse PCB applications.
    • Global Support & Installation: Available for worldwide installations with full servicing, ensuring ease of integration into production lines.
    • Proven Performance: A reliable, well-maintained legacy machine that has consistently delivered high output with minimal downtime.
    • Compact & Efficient: Optimized for smaller footprints in SMT lines without compromising on speed or accuracy.
  • Applications: Ideal for manufacturers involved in high-precision PCB assembly, including electronics, automotive, and telecommunications industries.
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参数 规格
元件贴装范围 0,6×0,3mm²(0201) – 18,7×18,7mm²
贴装精度 90μm (4sigma)
电路板尺寸 (单轨) 50×50mm² – 368×216mm²(2×2 – 14,5×18)
电路板尺寸 (双轨) 50×50mm² – 368×216mm²(2×2 – 14,5×8,5)
供料器容量 144 根料轨 (8mm de espessura)
功率 4 kW
压缩空气要求 6,5 – 10bar、950NI/min、管径 3/4″

Siemens Siplace HS-50 Chip Shooter – High-Performance SMT Placement System 西门子贴片机HS50 特点

高速贴装性能:能够快速拾取和贴装元件,提高生产效率。

高精度贴装:保证元件精确贴装在PCB指定位置,提高产品质量和稳定性。

灵活的元件处理能力:可以处理多种尺寸和类型的元件,适应不同的生产需求。

先进的视觉系统:有助于准确识别元件和定位,提高贴装准确性。

稳定可靠的性能:采用优质的材料和先进的制造工艺,确保设备长时间稳定运行

西门子贴片机HS50应用领域

  1. 消费电子产品制造:如智能手机、平板电脑、智能音箱等设备的电路板贴装。
  2. 汽车电子制造:用于汽车电子控制单元、车载娱乐系统、汽车传感器等产品的生产。
  3. 工业电子制造:包括工业控制器、仪器仪表、自动化设备等电子产品的贴片生产。
  4. 医疗电子制造:如医疗检测设备、医疗监护设备、康复辅助设备等的电路板贴装。

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