FUJI XP143 High-Speed SMT Pick and Place Machine – Precision Placement & Versatile Performance

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  • Brand: Fuji
  • Model: XP143
  • Type: High-Speed SMT Pick and Place Machine
  • Placement Speed: 21,800 CPH (0.165 sec/component), ensuring high-speed operation for fast-paced production lines
  • Component Size Range: Suitable for small to large components, ranging from 0402 to 20x20mm
  • Vision System: Equipped with “On-the-Fly” vision and Fuji’s proprietary Multi-Step (MS) vision processing for enhanced placement accuracy
  • Precisão: High placement accuracy with auto calibration to minimize errors and optimize production efficiency
  • Adaptability: Ideal for various SMT components, capable of handling a wide variety of parts in diverse production environments
  • Compact Design: Space-saving, efficient footprint that does not compromise on performance
  • Flexibilidade: Excellent for both chip shooting and versatile pick-and-place operations, ideal for rapid changeovers and varied production needs
  • Durability: Built to endure high-volume manufacturing environments, ensuring long-term reliability
  • Key Features:
    • High-Speed: Placement time of just 0.165 sec per component
    • Vision Processing: Advanced MS vision algorithm for precise component placement
    • Auto Calibration: Reduces setup time and improves accuracy
    • Versatile: Handles a wide range of components for flexible manufacturing needs
  • Ideal For: Electronics manufacturers requiring a high-speed, precise, and adaptable SMT pick and place machine for efficient assembly lines
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参数 规格
foto de 贴片范围 可贴装 0402(in01005) – 25×20mm、高度 6mm 以下的零件,通过选项可贴装 BGA、CSP
foto de 贴片速度 0,165 秒/个, 21.800 个/小时 (矩形元件); 0,180 秒/个, 20.000 个/小时 (0402 件)
foto de 贴片精度 ±0,050mm(cpk≧1,00,矩形元件等);±0,040mm(cpk≧1,00,QFP 等)
适用基板 Tamanho 457 × 356 mm, tamanho 50 × 50 mm, tamanho 3 - 4,0 mm
O que é isso? 100 segundos (50 minutos)
电路板加载时间 4.2º ano
Não é possível 前后方供料,共 100 个站位,台车换料方式,可选配单座 bandeja 盘供应器
机器尺寸 1.500 mm, 1.300 mm, 1.408,5 mm (排除信号塔)
机器重量 Peso 1800KG (por exemplo)
Não é possível Chinês, chinês tradicional, chinês tradicional
程序编辑 同时支持在线编程与脱机编程

O modelo XP143 é o mesmo

富士 XP143 贴片机的特点包括:

贴装能力:可贴装 0402(01005)极小芯片,通过选项也能贴装 BGA、CSP 等;能处理最大元件尺寸为 25×20mm,最大高Tamanho de 6 mm;个/小时(0,165 秒/个)。

O que é um gênio?:搭载单料盘平台和吸嘴自动更换器,支持 100 种元件(前侧、后侧各 50 种);具有送出侧缓冲功能和不废气贴片功能,支持试生产。

电路板处理:电子板尺寸最大为 457×356mm,最小为 50×50mm;电子板厚度支持 3 至 4,0mm。

精度方面:贴装精度较高,矩形元件等可达±0,050mm(cpk≧1,00),QFP 等可达±0,040mm(cpk≧1,00)。

机器规格: Peso 1.500 mm, 1.300 mm, 1.408,5 mm (1.408,5 mm)

此外, 不同来源提供的富士 XP143 相关信息可能存在差异,如需了解更详细准确的特点,建议参考富士官方资料或咨询相关专业人士。
O fabricante do XP143 é um fabricante profissional de acessórios para automóveis.
富士 XP143 是一款贴片机,主要应用于表面贴装技术(SMT)领域,可用于各类电子产品的生产制造。
具体来说,它适用于以下场景:

消费电子产品制造,如手机、平板电脑、智能手表等,这些产品通常包含大量小型电子元件,需要高精度、高速贴装。

计算机及周边设备生产,包括电脑主板、显卡、声卡等组件的贴片加工。

通信设备制造,例如路由器、交换机等设备中的电子元件贴装。

汽车电子领域,用于汽车控制系统、娱乐系统等相关电子部件的生产。

工业控制设备生产,涉及各种工业自动化设备中的电路板贴片。

医疗器械制造,一些医疗电子设备的生产也会用到该贴片机。

富士 XP143 贴片机能够贴装从 0402(01005)极小芯片到 20×20mm 的元件,具备较高的贴装精度和速度,可以满足多种电子产品对贴片工艺的要求。不过,实际应用中具体选择哪种贴片机还需根据生产需求、产品特点、预算等因素综合考虑。

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