Siemens SIPLACE X3 S – High-Speed SMT Pick and Place Machine

$1.00

  • Brand: Siemens (ASM)
  • Model: SIPLACE X3 S
  • Type: High-Speed SMT Pick and Place Machine
  • Key Features:
    • Unmatched Speed: The SIPLACE X3 S offers a maximum placement rate of up to 16,800 components per hour (cp/h), making it one of the fastest machines in its class for high-throughput production.
    • Flexible Gantry System: Features a 3-gantry configuration, supporting diverse component handling needs, from small chips to larger components.
    • Advanced Modular Design: With modular cantilever technology, the SIPLACE X3 S is highly customizable, allowing for flexible setups with 2, 3, or 4 cantilevers.
    • Optimized for Precision: The machine delivers high-precision placement, ensuring accurate assembly of complex PCBs even for micro-components (e.g., 0201 packages).
    • Enhanced Feeder Capacity: Supports up to 160 x 8mm feeders, enabling efficient material handling and reducing changeover time.
    • Global Availability: Widely available and supported globally, ensuring easy installation, maintenance, and service.
  • Applications: The SIPLACE X3 S is ideal for manufacturers in industries like consumer electronics, automotive, telecommunications, and medical devices, where high-speed and high-accuracy placement is critical for high-volume PCB production.
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项目 详情
产品名称 西门子 X3 多功能贴片机
应用范围 手机、平板电脑、笔记本电脑、LED 贴装等电子产品生产
功能特点 高速贴片、低缺陷率(DPM)、稳定处理 0201(公制)、不停线设置转换、快速新品导入
Não é possível 3
贴装性能 – IPC 速度可达 78.100cph
– SIPLACE 基准评测为 94.500cph
– Taxa de câmbio 127.875cph
贴装准确性 ±22μm/3σ
角精度 ±0,05°/3σ
元器件范围 01005″ – 200x125mm
传送带模式 异步、同步、独立贴装(X4iS)
PCB em movimento – X4S、X3S:50x50mm²至 650x560mm²
– X4iS:50x50mm² ou 610x560mm²
PCB de alta qualidade 0,3 mm a 4,5 mm
PCB em branco Peso 3kg
供料器位置 – X3S e X4S: 160 x 8mm X 供料器模块
– X4iS: 148 x 8 mm X tamanho maior
西门子 X3 多功能贴片机特点

foto de 高速贴牴:理论速度可达127.875cph,IPC 速度为78.100cph,SIPLACE 基准评测为94.500cph。

高精度贴装:贴装准确性达±22μm/3σ,角精度为±0,05°/3σ。

处理小尺寸元件能力强:可稳定处理0201(公制)元件。

O que é um livro de histórias de amor?:元器件范围是01005″ – 200x125mm。

具备不停线设置转换功能:能够快速进行新品导入,提高生产效率。

O que é um 灵活的?:包括异步、同步、独立贴装(X4iS)模式。

Placa de circuito impresso PCB de 10 polegadas:PCB 格式方面,X4S、X3S 为50x50mm²至650x560mm²,X4iS 为50x50mm²至610x560mm²;PCB 厚度为0.3mm 至4.5mm(其他厚度可根据要求定制);PCB 最大重量为3kg。

O autor do livro é o autor do livro:X3S e X4S 拥有160 个 8mm X 供料器模块。

不同型号的西门子贴片机在性能和功能上可能会有所差异,具体特点还需参考相应的产品规格和说明。在实际应用中,可以根据生产需求和工艺要求选择合适的贴片机型号。
西门子 X3 多功能贴片机的应用领域
西门子 X3 多功能贴片机的应用领域广泛,包括但不限于以下几个方面:

 

应用领域 说明
消费电子产品制造 可用于手机、平板电脑、智能手表、数码相机等消费电子产品的电路板贴片生产,满足这些产品小型化、高精度的贴片需求
O que é o conteúdo do site? 在台式电脑、笔记本电脑的主板、显卡等部件的生产中发挥作用,高效、精准地完成电子元件的贴装
汽车电子制造 应用于汽车的控制单元、导航系统、安全系统等电子部件的生产,保障汽车电子产品的高质量和稳定性
通信设备生产 用于制造路由器、交换机、基站等通信设备的电路板,实现高速、高精度的贴片作业
O que é um filme de terror? 工业控制器、传感器、测量仪器等设备的电路板贴片生产,满足工业级电子产品的可靠性要求
医疗电子设备制造 如心脏起搏器、血糖仪、血压计等医疗电子设备的生产过程中,精确贴装各类电子元件

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