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Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

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  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production and flexible small-batch manufacturing.
  • Key Features:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including electronics manufacturing, automotive and consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision and speed in their SMT production lines, such as those in the electronics and automotive industries, as well as companies dealing with complex and fine-pitch components.
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技术规格 参数
対象电路板尺寸（L×W） MAX457mm×356mm
厚度 0.4（0.3）～5.0mm/MIN50mm×50mm
电路板载入时间 1.8sec
机器尺寸（L×W×H） 1,500mm×1,607.5mm×1,419.5mm（搬运高度:900mm、除信号塔）
机器重量 本机：1,500kg，MFU-40：约240kg（满载W8供料器时），BTU-AII：约120kg，BTU-B：约15kg，MTU-AII：约615kg（满载料盘、供料器吋）
吸嘴数 12（旋转自动更换头）
自动更换头收藏数 2
对象元件 0402(01005)～20×20mm，高度MAX3.0mm
贴装节拍 0.144sec/个，25,000cph
贴装精度 小型芯片元件等±0.050mm cpk≧1.00～±0.066mm cpk≧1.33，QFP元件±0.040mm cpk≧1.00～±0.053mm cpk≧1.33

富士 XPF 贴片机的特点

自动更换贴装工作头：可以在生产中自动更换贴装工作头，实现了世界领先的自动更换工作头。因为可以在机器运转中从高速工作头自动更换为多功能工作头，对所有元件可以始终以较佳工作头进行贴装。也可以自动更换涂敷胶着剂的工作头，仅用 1 台机器就可以进行涂敷胶着剂和贴装元件。

消除高速机和多功能机的界限：通过实现自动更换工作头，消除了高速机和多功能机的界限（无边界）。对于所有电路板种类，因为机器间的平衡始终处于较优状态，所以可以较大限度地发挥机器的能力。

高精度贴装：小型芯片元件等±0.050mm cpk≧1.00～±0.066mm cpk≧1.33，QFP 元件±0.040mm cpk≧1.00～±0.053mm cpk≧1.33。

高生产效率：贴装节拍可达 0.144sec/个，25,000cph。

兼容多种元件：对象元件范围广泛，包括 0402(01005)～20×20mm，高度 MAX3.0mm 的元件。灵活的元件包装：支持料带元件（JIS 规格、JEITA）、料管元件、料盘元件等多种包装形式。

富士 XPF 贴片机的应用领域

富士 XPF 贴片机主要应用于表面贴装技术（SMT）生产线，能够高速、高精度、全自动地贴放各种电子元件，如芯片、电阻、电容、连接器等，具体应用领域包括但不限于以下几个方面：
消费电子：如手机、平板电脑、笔记本电脑、数码相机等。
汽车电子：如汽车导航系统、汽车音响、汽车安全系统等。
工业控制：如工业自动化设备、仪器仪表、医疗器械等。
通信设备：如路由器、交换机、基站等。
航空航天：如卫星、飞机等航空航天设备。

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