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FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
  1. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
  2. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
  3. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly

FUJI NXT M6III Pick and Place Machine – High-Speed, Modular SMT Solution for Precision Assembly

$1.00

  • The FUJI NXT M6III is a highly efficient pick and place machine designed for high-speed SMT assembly. It features cutting-edge modular design, advanced vision systems, and the latest high-speed head modules for improved productivity and precision placement in surface mount technology.
  • Key Features:
    • Modular Design: Easily adaptable to various production needs, maximizing flexibility and scalability.
    • High-Speed XY Manipulator: Provides fast and accurate component placement, achieving up to 37,500 CPH (chips per hour).
    • Advanced Camera Systems: The newly developed Fixed On-the-fly camera improves component alignment and inspection.
    • Dual Track Feeder System: Enhances feeding capacity and speeds up the assembly process, ensuring continuous production flow.
    • CE Certified: Meets international standards for safety and quality.
  • Applications: Ideal for high-volume, high-precision electronics manufacturing and SMT production lines, including those focused on high-density components.
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参数 详情
贴片速度 矩形元件：0.43 秒/个，8370 个/小时；IC 等：0.56 秒/个，6420 个/小时
贴装精度 矩形元件等：±0.050mm cpk≥1.00；QFP 等：±0.040mm cpk≥1.00
元件范围 0603-45mm×150mm
PCB 尺寸 双轨：48×48~510x534mm；单轨：48×48~610x534mm
进板速度 双搬运轨道，连续运转时 0sec；单搬运轨道，3.4sec
料架支持 M3II：20 站（以 8mm 算）；M6II/M6IISP：45 站（以 8mm 算）
机器尺寸 M3II 基座：740L×1934W×1474mmH；M6II 基座：1390L×1934W×1476mmH
机器重量 约 1800Kg
气压要求 0.5MPa（5kgf/cm2），10NL/Min
电压要求 3P/200V/10KVA
语言支持 中、英、日等 7 种语言
操作系统 Windows 操作系统
程序编辑 同时支持在线编程与脱机编程

富士 XP243 贴片机的特点

  • 高精度：贴装精度高达±0.050mm，对于矩形元件等贴片精度更高。
  • 高速贴片：贴片速度快，每小时可贴装8,370个矩形元件。
  • 多功能：可贴装从0603（0201）芯片到45mm×150mm的元件，范围广泛。
  • 紧凑设计：机器结构紧凑，占用空间小。
  • 操作方便：支持中、英、日等多种语言，操作界面友好。
  • 灵活配置：可根据生产需求自由组合贴装工作头、元件供应单元和搬运轨道等单元。 FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly

富士 XP243 贴片机的应用领域

富士 XP243 贴片机主要应用于电子信息制造业，包括消费电子制造业、汽车电子制造业、通信设备制造业等行业，以下是一些具体应用领域：
消费电子：贴片机可用于生产手机、平板电脑、笔记本电脑、数码相机等消费电子产品。
汽车电子：在汽车电子领域，贴片机被广泛应用于生产汽车电子控制单元、仪表盘、导航系统等。
通信设备：贴片机可用于生产通信基站、路由器、交换机等通信设备的电子组件。
工业控制：在工业自动化领域，贴片机可用于生产工业控制设备、机器人、传感器等的电子组件。
医疗电子：贴片机可用于生产医疗设备、医疗器械等的电子组件。

 

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