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Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
  1. Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
  2. Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
  3. Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution
  4. Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution

Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

$1.00

  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production 그리고 flexible small-batch manufacturing.
  • 주요 특징:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including 전자 제조, automotive 그리고 consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision 그리고 speed in their SMT production lines, such as those in the electronics 그리고 automotive industries, as well as companies dealing with complex and fine-pitch components.
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기술 분석표 인수
対象电路板尺寸（L×W） 최대457mm×356mm
厚度 0.4（0.3）～5.0mm/MIN50mm×50mm
철도판 이동 입출고 시간 1.8초
기계 크기(L×W×H) 1,500mm×1,607.5mm×1,419.5mm(搬运고도:900mm、除信号塔)
기계 중량 本机：1,500kg，MFU-40：约240kg（满载W8供料器时），BTU-AII：约120kg，BTU-B：约15kg，MTU-AII：约615kg（满载料盘、供料器吋)
흡입수 12（회전자극자극）
자기 조작 머리수집량 2
대식가원품 0402(01005)~20×20mm, 높이MAX3.0mm
장신구 0.144초/초, 25,000cph
장수율 소형 부품 부품 부품 ±0.050mm cpk≧1.00~±0.066mm cpk≧1.33,QFP 부품 ±0.040mm cpk≧1.00~±0.053mm cpk≧1.33

Fuji XPF-L High-Speed Multi-Purpose Mounter - Advanced SMT Placement Solution

후스 XPF 부품 기계의 특별점

자기 조작 개조 제작 머리：可以在生产中自动更换贴装工作头，实现了世界领先的自动更换工作头.更换为多功能工작품头，对所有원件可以始终以较佳工작품头1 台机器就可以进行涂敷胶着剂와贴装元件.

消除高速机와多功能机的界限：통신은 자동으로 실행됩니다.始终处于较优状态，所以可以较大限島地发挥机器的能力。

고급형 의류：소형 부품 치수 ±0.050mm cpk≧1.00~±0.066mm cpk≧1.33,QFP 치수 ±0.040mm cpk≧1.00~±0.053mm cpk≧1.33。

고생종교재：贴装节拍可达 0.144sec/个，25,000cph。

여러 품목을 합치다：对象원정은 包括 0402(01005)~20×20mm, 높이 MAX3.0mm 의 원수입니다.생명의 원부품 패키지：支持料带원件（JIS 规格、JEITA）、料管元件、料盘元件等多种包装shape式。

XPF 파일은 사용 가능한 파일입니다.

富士 XPF 贴 Images 机主要应用于表face贴装技术 (SMT)生产线, 能够高速, 高精titude, 全自动地贴放各种电子 元件,如芯 Pictures, 电阻, 电容,连接器等，具体应用领域包括但不限于以下几个방면 :
삭제된 영화：如手机、平板电脑、笔记本电脑、数码机等。
자동차 영화：如汽车导航系统、汽车Music响、汽车security系统等。
공장 감독：如工业自动化设备、仪器仪表、医疗器械等.
통신 개발：如路由器、交换机、基站等。
항공우주항공천：如卫聖、飞机等航空航天设备。

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