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Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

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  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production Dan flexible small-batch manufacturing.
  • Fitur Utama:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including manufaktur elektronik, automotive Dan consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision Dan speed in their SMT production lines, such as those in the electronics Dan automotive industries, as well as companies dealing with complex and fine-pitch components.
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対象电路板尺寸（P×L） Ukuran MAX457mm×356mm
sedikit lebih 0,4 (0,3)～5,0mm/MIN50mm×50mm
电路板载入时间 1,8 detik
Ukuran Standar (P x L x T) 1.500mm×1.607.5mm×1.419.5mm（搬运高度:900mm、除信号塔）
机器重量 Kapasitas：1.500kg，MFU-40：240kg（满载W8供料器时），BTU-AII：120kg，BTU-B：约15kg，MTU-AII：约615kg（满载料盘、供料器吋）
吸嘴数 12（旋转自动更换头）
自动更换头收藏数 2
对象元件 0402(01005)～20×20mm,高度MAX3.0mm
贴装节拍 0,144 detik/jam, 25.000 cph
贴装精度 小型芯片元件等±0,050mm cpk≧1,00～±0,066mm cpk≧1,33,QFP元件±0,040mm cpk≧1,00～±0,053mm cpk≧1,33

Unduh XPF untuk mengunduh aplikasi

自动更换贴装工作头：可以在生产中自动更换贴装工作头,实现了世界领先的自动更换工作头。因为可以在机器运rencana perjalanan动更换为多功能工作头,对所有元件可以始终以较佳工作头进行贴装。也可以自动更换涂敷胶着剂的工作头,仅用 1 台机器就可以进行涂敷胶着剂和贴装元件。

消除高速机和多功能机的界限：通过实现自动更换工作头，消除了高速机和多功能机的界限（无边界）。对于所有电路板种类，因为机器间的平衡始终处于较优状态,所以可以较大限度地发挥机器的能力。

高精度贴装：小型芯片元件等±0,050mm cpk≧1,00～±0,066mm cpk≧1,33,QFP 元件±0,040mm cpk≧1,00～±0,053mm cpk≧1,33。

高生产效率：贴装节拍可达 0,144detik/个,25,000cph。

Tempat sampah plastik：对象元件范围广泛，包括 0402(01005)～20×20mm，高度 MAX3.0mm 的元件。Layanan Pelanggan yang Terhormat：支持料带元件（JIS 规格、JEITA）、料管元件、料盘元件等多种包装形式。

富士 XPF untuk Windows 10

Kartu XPF untuk Windows XPF子元件，如芯片、电阻、电容、连接器等，具体应用领域包括但不限于以下几个方面：
消费电子：如手机、平板电脑、笔记本电脑、数码相机等。
Alat pemutar film：如汽车导航系统、汽车音响、汽车安全系统等。
Tempat sampah：如工业自动化设备、仪器仪表、医疗器械等。
通信设备：如路由器、交换机、基站等。
航空航天：如卫星、飞机等航空航天设备。

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