10-Spindle Configuration: The DECAN S1 is equipped with 10 spindles to handle high-speed component placement, making it ideal for large-scale production lines.
Fast Placement Speed: Capable of placing up to 47,000 components per hour (CPH), ensuring high throughput for high-volume manufacturing.
Advanced Vision System: Integrated with mega-pixel fly cameras, providing precision placement even for ultra-small components like 03015 and ensuring high placement accuracy.
Wide PCB Size Range: Supports a broad range of PCB sizes, from 50x40mm to 1500x460mm, making it highly versatile for different production needs.
Improved Productivity: The DECAN S1 is designed to improve actual productivity et placement quality, optimizing operations and minimizing errors.
Highly Flexible: Supports up to 120 feeders, accommodating a wide variety of components and configurations, making it adaptable to different production requirements.
Ideal for Batch Production: Perfect for companies requiring a high-speed, reliable, and flexible chip mounter for batch production in industries such as consumer electronics, automotive, and telecommunications.
Applications: Suitable for manufacturers that need a high-performance SMT chip mounter for efficient and accurate component placement in mass production environments. Ideal for assembling SMD et LED components.
