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High-speed modular placement machine NPM-W2
High-speed modular placement machine NPM-W2
High-speed modular placement machine NPM-W2
High-speed modular placement machine NPM-W2
High-speed modular placement machine NPM-W2
High-speed modular placement machine NPM-W2
  1. High-speed modular placement machine NPM-W2
  2. High-speed modular placement machine NPM-W2
  3. High-speed modular placement machine NPM-W2
  4. High-speed modular placement machine NPM-W2
  5. High-speed modular placement machine NPM-W2
  6. High-speed modular placement machine NPM-W2

High-speed modular placement machine NPM-W2

Mounting speed：16-nozzle placement head (when equipped with 2 placement heads) ON high production mode, the placement speed is 77000cph (0.047s/chip), and the IPC9850 (1608) speed is 59200cph. 16-nozzle placement head (when equipped with 2 placement heads) OFF high production mode, the placement speed is 70000cph (0.051s/chip), and the IPC9850 (1608) speed is 56000cph. 12-nozzle placement head (when equipped with 2 placement heads) ON high production mode, the placement speed is 64500cph (0.056s/chip), and the IPC9850 (1608) speed is 49500cph. 12-nozzle placement head (when equipped with 2 placement heads) OFF high production mode, the placement speed is 62500cph (0.058s/chip), IPC9850 (1608) speed is 48000cph. 8-nozzle placement head (when equipped with 2 placement heads), the placement speed is 40000cph (0.090s/chip).
3-nozzle placement head (when equipped with 2 placement heads), the placement speed is 11000cph (0.33s/QFP).
Mounting accuracy (Cpk≧1): 16-nozzle placement head ON high production mode, placement accuracy is ±40μm/chip. 16-nozzle placement head OFF high production mode, placement accuracy is ±30μm/chip (±25μm/chip is the corresponding accuracy of the optional part).
12-nozzle head ON high production mode, placement accuracy is ±40μm/chip. 12-nozzle head OFF high production mode, placement accuracy is ±30μm/chip. 8-nozzle head, placement accuracy is ±30μm/chip, ±30μm/QFP 12mm-32mm, ±50μm/QFP 12mm or less. 3-nozzle head, placement accuracy is ±30μm/QFP.
Component range：0402 chip～L150×W25×T30mm (L represents the component length, W represents the component width, and T represents the component height). Specifically:
The component size corresponding to the 16-nozzle placement head ON high production mode is 0402 chip ~ L6×W6×T3. The component size corresponding to the 16-nozzle placement head OFF high production mode is 03015 (requires special nozzles and tape feeders), 0402 chip ~ L6×W6×T3.
The component size corresponding to the 12-nozzle placement head ON high production mode is 0402 chip ~ L12 × W12 × T6.5. The component size corresponding to the 12-nozzle placement head OFF high production mode is 0402 chip ~ L12 × W12 × T6.5. The component size corresponding to the 8-nozzle placement head is 0402 chip ~ L32 × W32 × T12. The component size corresponding to the 3-nozzle placement head is 0603 chip ~ L150 × W25 (diagonal 152) × T30.
PCB size：Single track * 1 overall installation, PCB size is L50mm×W50mm～L750mm×W550mm. Single track * 1 2 position installation, PCB size is L50mm×W50mm～L350mm×W550mm. Dual track * 1 single track transmission, PCB size is L50mm×W50mm～L750mm×W510mm. Dual track * 1 dual track transmission, PCB size is L50mm×W50mm～L750mm×W260mm.

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parameter Specification
Substrate size Monorail1 Overall installation: L50mm×W50mm～L750mm×W550mm
Monorail1 Two positions for installation: L50mm×W50mm～L350mm×W550mm
Dual Track1 Monorail transmission: L50mm×W50mm～L750mm×W510mm
Dual Track1Dual track transmission: L50mm×W50mm～L750mm×W260mm
power supply Three-phase AC200, 220, 380, 400, 420, 480V, 2.8kVA
Air pressure source*2 0.5MPa, 200L/min (ANR)
Equipment size*2 W1280mm×D2332mm×H1444mm
weight 2470kg (only for the main body, varies according to the composition of optional parts)
Mounting head specifications 16-nozzle placement head (when equipped with 2 placement heads) ON high production mode:
– Maximum placement speed: 77000cph (0.047s/chip)
– IPC9850 (1608): 59200cph
– Mounting accuracy (Cpk≧1): ±40μm/chip
– Component size range: 0402 chip ~ L6×W6×T3mm
16-nozzle placement head (when equipped with 2 placement heads) OFF high production mode:
– Maximum mounting speed: 70000cph (0.051s/chip)
– IPC9850 (1608): 56000cph
– Placement accuracy (Cpk≧1): ±30μm/chip (±25μm/chip)
– Component size range: 03015, 0402 chips ~ L6×W6×T3mm
12-nozzle placement head (when equipped with 2 placement heads) ON high production mode:
– Maximum placement speed: 64500cph (0.056s/chip)
– IPC9850 (1608): 49500cph
– Mounting accuracy (Cpk≧1): ±40μm/chip
– Component size range: 0402 chip ~ L12×W12×T6.5mm
12-nozzle placement head (when equipped with 2 placement heads) OFF high production mode:
– Maximum placement speed: 62500cph (0.058s/chip)
– IPC9850 (1608): 48000cph
– Mounting accuracy (Cpk≧1): ±30μm/chip
– Component size range: 0402 chip ~ L12×W12×T6.5mm
8-nozzle placement head (when equipped with 2 placement heads):
– Maximum placement speed: 40000cph (0.090s/chip)
– Mounting accuracy (Cpk≧1): ±30μm/chip, ±30μm/QFP 12mm～32mm, ±50μm/QFP 12mm or less
– Component size range: 0402 chip ~ L32×W32×T12mm
3-nozzle placement head (when equipped with 2 placement heads):
– Maximum placement speed: 11000cph (0.33s/QFP)
– Mounting accuracy (Cpk≧1): ±30μm/QFP
– Component size range: 0603 chip ~ L150×W25 (diagonal 152)×T30mm
Component supply The tape width is 8/12/16/24/32/44/56mm, up to 120 tapes (8mm tape, double tape rack, use small reel)

High-speed modular placement machine NPM-W2 Features of High-speed Modular Mounter NPM-W2

  • Coherent systems for efficient and high-quality production：A continuous placement and inspection system that can choose high production mode or high precision mode according to actual installation requirements.
  • Compatible with large substrates and components：Can handle large substrates of 750×550mm, and the component range is expanded to L150×W25×T30mm.
  • Double track installation improves productivity per unit area: The dual-track mounting mode has two options: alternating mounting and independent mounting. Alternating mounting means that the mounting heads at the front and rear of the equipment perform alternating mounting on the substrates of the front and rear tracks; independent mounting means that the mounting head at the front side of the equipment performs mounting on the substrate of the front track, and the mounting head at the rear side performs mounting on the substrate of the rear track.
  • Multi-recognition camera: Uniquely combines three independent imaging functions into one system, including 2D alignment, component thickness detection and 3D coplanar measurement, to achieve high-speed component height direction recognition inspection and stable high-speed installation of special-shaped components.
  • Optional various placement heads: Such as lightweight 16-nozzle placement head, 12-nozzle placement head, lightweight 8-nozzle placement head, 3-nozzle placement head V2, dispensing head, 2D inspection head, etc., to meet different needs.
  • High production and high precision mode: The maximum speed of high production mode (ON) can reach 77000cph (0.047s/chip, IPC9850 (1608): 59200cph), and the placement accuracy is ±40μm; the maximum speed of high precision mode (OFF) is 70000cph (0.051s/chip), and the placement accuracy is ±30μm (optional parts can reach ±25μm).
  • Quick-change feeder cart with automatic plate support setup: Easy to operate and has an extended nozzle capacity for 120 feeders.
  • Supply unit specifications can be changed：By reorganizing the tray feeder or exchanging the trolley, it can adapt to the production line configuration of different component supply forms.

Application fields of high-speed modular placement machine NPM-W2

High-speed modular placement machine NPM-W2 is mainly used in surface mount technology (SMT) production lines and can be used for the production of electronic products in the following fields:
  1. Consumer Electronics：Such as circuit board assembly of various consumer electronic products such as mobile phones, tablet computers, televisions, and speakers.
  2. Computer hardware：Including the mounting of motherboards and other related components of desktop computers and laptops.
  3. communication device: For example, the production of circuit boards in mobile phone base stations, routers, switches and other communication equipment.
  4. vehicle electronics：Manufacturing of electronic products such as electronic control units, instrument panels, navigation systems, etc. in automobiles.
  5. industrial control：Used for circuit board mounting of industrial automation equipment, instruments and other products.
  6. Medical Devices：Production of some medical electronic equipment, such as small medical instruments, diagnostic equipment, etc.
  7. Aerospace Electronics：In the aerospace field, this chip mounter may be used in the assembly of some electronic equipment.
  8. Smart Appliances：Production of control circuit boards for various smart home appliances, such as smart refrigerators, smart washing machines, etc.

 

It can mount electronic components of various specifications at high speed and high precision, including chips, resistors, capacitors, inductors, transistors, etc., and can also handle large substrates and large components to meet the needs of different electronic products for patch assembly. Its dual-track mounting function can also achieve high unit area productivity and improve production efficiency. In addition, by selecting different mounting heads, it can flexibly adapt to a variety of production needs and component types.

BUYSMT provides second-hand Panasonic SMT machines, including feeders and related accessories. BUYSMT has extensive business in providing electronics manufacturers with various models of Panasonic SMT machines, such as the NPM series and CM602 series, for leasing and selling. At the same time, BUYSMT provides the best prices and information on the SMT industry.

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BUYSMT is a leading supplier of SMT components and machines, committed to providing quality products and services to global electronics manufacturers. With rich industry experience and a professional procurement team, we can meet your various SMT needs.

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contact number

+86 180 0253 3732

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company address

Room 302, 3rd Floor, Building C, Xinerdingfeng Technology Park, No. 2 Nanling Road, Shajing Street, Bao'an District, Shenzhen, Guangdong

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