Panasonic high-speed modular placement machine NPM-W
Mounting speed: The maximum mounting speed of the 16-nozzle placement head (when equipped with 2 placement heads) is 70,000 cph (0.051s/chip); the maximum mounting speed of the 12-nozzle placement head (when equipped with 2 placement heads) is 62,500 cph (0.058s/chip); the maximum mounting speed of the 8-nozzle placement head (when equipped with 2 placement heads) is 40,000 cph (0.090s/chip); the maximum mounting speed of the 3-nozzle placement head (when equipped with 2 placement heads) is 11,000 cph (0.33s/QFP).
Mounting accuracy:(Cpk≧1): ±40μm/chip
Component range: 0402 chip ~ L6 × W6 × T3 (when using a 16-nozzle placement head); 0402 chip ~ L12 × W12 × T6.5 (when using a 12-nozzle placement head); 0402 chip ~ L32 × W32 × T12 (when using an 8-nozzle placement head); 0603 chip ~ L150 × W25 (diagonal 152) × T28 (when using a 3-nozzle placement head).
PCB size: Single track * 1 overall installation: L50mm×W50mm～L750mm×W550mm; Single track * 1 two positions installation L50mm×W50mm～L350mm×W550mm; Double track * 1 single track transmission: L50mm×W50mm～L750mm×W510mm; Double track * 1 double track transmission: L50mm×W50mm～L750mm×W260mm.
| parameter | Specification |
|---|---|
| Substrate size | Monorail overall installation: L50mm×W50mm ～ L750mm×W550mm Double track single track transmission: L50mm×W50mm ～ L750mm×W510mm Double track transmission: L50mm×W50mm ～ L750mm×W260mm |
| Substrate replacement time | Single track overall installation: 4.4s (when there is no component mounted on the back of the substrate) Double-track single-track transmission: 4.4s (when there is no component on the back of the substrate) Dual-track transmission: 0s (cannot be 0s when the cycle time is less than 4.4s) |
| power supply | Three-phase AC200, 220, 380, 400, 420, 480V, 2.5kVA |
| Air pressure source | 0.5MPa, 200L/min (ANR) |
| Equipment size | W1280mm×D2332mm×H1444mm |
| equipment weight | 2250kg (only for the main body, varies according to the optional components) |
| Mounting accuracy (Cpk≧1) | ±40μm/chip (16, 12, 8 nozzle placement heads); ±30μm/QFP 12mm~32mm, ±50μm/QFP 12mm or less (8 nozzle placement head); ±30μm/QFP (3 nozzle placement head) |
| Mounting speed (cph) | 16-nozzle placement head (when equipped with 2 placement heads): 70,000 (0.051s/chip) 12-nozzle placement head (when equipped with 2 placement heads): 62500 (0.058s/chip) 8-nozzle placement head (when equipped with 2 placement heads): 40000 (0.090s/chip) 3-nozzle placement head (when equipped with 2 placement heads): 11000 (0.33s/QFP) |
| IPC9850 (1608) speed (cph) | 16 nozzle placement head: 53800 12 nozzle placement head: 48000 |
| Mountable component size range | 16-nozzle placement head: 0402 chip (0603 chip) ~ L6×W6×T3 12 nozzle placement head: 0402 chip (0603 chip) ~ L12×W12×T6.5 8-nozzle placement head: 0402 chip (0603 chip) ~ L32×W32×T12 3 nozzle placement head: 0603 chip ~ L150×W25 (diagonal 152)×T28 |
| Tape width | 8/12/16/24/32/44/56mm |
| Rack Specifications | Up to 120 tapes (8mm tape, double tape rack (small reel)) |
| Identifiable component types | Chip, QFP, BGA, CSP, etc. |
| visual system | High-precision component recognition system to ensure accurate placement |
| operating system | Friendly human-machine interface, easy to operate |
| Production Capacity | High production efficiency can be achieved according to different configurations and production needs |
| Equipment stability | Use advanced technology and high-quality components to ensure stable operation of the equipment |
| Maintenance convenience | Reasonable design, easy for daily maintenance and care |
Application areas of Panasonic high-speed modular placement machine NPM-W
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