Panasonic NPM-D module high speed placement machine
Mounting speed：It varies according to different placement heads and modes. For example, the maximum placement speed of a 16-nozzle placement head (when equipped with 2 placement heads) is 70,000 cph (0.051s/chip); the maximum placement speed of a 12-nozzle placement head (when equipped with 2 placement heads) is 62,500 cph (0.058s/chip); the maximum placement speed of an 8-nozzle placement head (when equipped with 2 placement heads) is 40,000 cph (0.090s/chip); the maximum placement speed of a 2-nozzle placement head (when equipped with 2 placement heads) is 8,500 cph (0.423s/chip).
Mounting accuracy (Cpk≧1): ±40μm/chip.
Component range：The size of the components that can be mounted is usually 0402 chip and above, which varies depending on the mounting head. For example, the component size corresponding to the 16-nozzle mounting head is 0402 chip ~ L6×W6×T3; the component size corresponding to the 12-nozzle mounting head is 0402 chip ~ L12×W12×T6.5; the component size corresponding to the 8-nozzle mounting head is 0402 chip ~ L32×W32×T12; the component size corresponding to the 2-nozzle mounting head is 0603 chip ~ L100×W90×T28.
PCB size: The double-track type is L50mm×W50mm～L510mm×W300mm; the single-track type is L50mm×W50mm～L510mm×W590mm.
| Details | |
|---|---|
| Model Name | NPM-W2 |
| Substrate size | Monorail1: Overall installation L50mm×W50mm～L750mm×W550mm, 2 positions installation L50mm×W50mm～L350mm×W550mm Dual Track1: Single track transmission L50mm×W50mm～L750mm×W510mm, double track transmission L50mm×W50mm～L750mm×W260mm |
| power supply | Three-phase AC200, 220, 380, 400, 420, 480V, 2.8kVA |
| Air pressure source*2 | 0.5MPa, 200L/min (ANR) |
| Equipment size*2 | W1280mm×D2332mm×H1444mm |
| weight | 2470kg (only for the main body, varies according to the composition of optional parts) |
| Placement head | 16-nozzle placement head (when equipped with 2 placement heads) ON High production mode: PlacementFast speed 77000cph (0.047s/chip), IPC9850 (1608): 59200cph6. Mounting accuracy (Cpk≧1) ±40μm/chip, component size (mm) 0402 chip8～L6×W6×T3 16-nozzle placement head (when equipped with 2 placement heads) OFF High production mode: PlacementFast speed 70000cph (0.051s/chip), IPC9850 (1608): 56000cph6. Mounting accuracy (Cpk≧1) ±30μm/chip (±25μm/chip7) Component size (mm) 0301589. 0402 Chip8～L6×W6×T3 12-nozzle placement head (when equipped with 2 placement heads) ON High production mode: PlacementFast speed 64500cph (0.056s/chip), IPC9850 (1608): 49500cph6. Mounting accuracy (Cpk≧1) ±40μm/chip, component size (mm) 0402 chip8～L12×W12×T6.5 12-nozzle placement head (when equipped with 2 placement heads) OFF High production mode: PlacementFast speed 62500cph (0.058s/chip), IPC9850 (1608): 48000cph6. Mounting accuracy (Cpk≧1) ±30μm/chip, component size (mm) 0402 chip8～L12×W12×T6.5 8-nozzle placement head (when equipped with 2 placement heads): PlacementFast speed 40000cph (0.090s/chip), placement accuracy (Cpk≧1) ±30μm/chip, ±30μm/QFP 12mm～32mm, ±50μm/QFP 12mm or less, component size (mm) 0402 chip8～L32×W32×T12 3-nozzle placement head v2 (when equipped with 2 placement heads): PlacementFast speed 11000cph (0.33s/QFP), placement accuracy (Cpk≧1) ±30μm/QFP, component size (mm) 0603 chip ~ L150×W25 (diagonal 152)×T30 |
| Component supply | Tape: Tape width 8/12/16/24/32/44/56mm, Max.120 (8mm tape, double tape rack (small reel)); Rod: Front and rear exchange trolley specification Max.14, single pallet specification Max.10, double pallet specification Max.7; Pallet: Single pallet specification Max.20, double pallet specification Max.40 |
Features
High productivity: The newly developed lightweight 16-nozzle placement head, multi-function recognition camera and high-rigidity frame are used to improve the production capacity per unit area while achieving high-precision installation, and can also reduce substrate transmission losses to improve overall productivity.
Versatility: It has lightweight 16-nozzle and 12-nozzle mounting heads that can mount tiny components at high speed, 8-nozzle mounting heads that can mount tiny to medium-sized components at high speed, and 2-nozzle mounting heads that can handle various special-shaped components. These heads can be used in combination; by combining various 2D inspection heads for inspecting production substrates and dispensing heads for adhesive dispensing for temporary bonding of electronic components, it can handle a variety of processes; purchased mounting heads can be exchanged; a multi-functional recognition camera that combines 2D measurement, thickness measurement, and 3D measurement is used, which can be upgraded from 2D measurement specifications to 3D measurement specifications (thickness measurement, 3D measurement).
Model switching: In independent installation mode, while one side of the track is producing, the other side of the track can switch models; through options, it can correspond to the automatic replacement of support pins and automatic model switching, and can switch models according to the customer's production form.
High-quality mounting: Inherits various units and functions of NPM-D2/D to achieve high-quality mounting.
Model Name: NPM-D34
Substrate size (mm): Double track type is L50×W50～L510×W300; Single track type is L50×W50～L510×W590
Substrate replacement time: For double-track type, the cycle time cannot be 0s when it is less than 3.6s, otherwise it is 0s; for single-track type, it is 3.6s (when a short-type conveyor belt is selected)
power supply: Three-phase AC200, 220, 380, 400, 420, 480V, 2.7kVA
Air pressure source：0.5MPa, 100L/min (ANR)
Equipment size (mm): W832×D2652×H1444 (length×depth×height)
weight: 1680kg (only for the main body, varies according to the configuration of optional parts)
Placement head:
16 nozzle head (equipped with 2 cantilevers) ON high production mode: the placement speed is 84000cph (0.043s/chip), IPC9850 can reach 63300cph; the placement accuracy (Cpk≧1) is ±40μm/chip, and the component size (mm) that can be placed is 0402 chip ~ L6×W6×T3.
16 nozzle head (equipped with 2 cantilevers) OFF High production mode: The placement speed is 76000cph (0.047s/chip), IPC9850 can reach 57800cph; the placement accuracy (Cpk≧1) is ±30μm/chip (±25μm/chip) and the size of the mountable components (mm) is 03015~L6×W6×T3.
12 nozzle head (equipped with 2 cantilevers): The mounting speed is 69000cph (0.052s/chip), IPC9850 can reach 50700cph; the mounting accuracy (Cpk≧1) is ±30μm/chip, and the mountable component size (mm) is 0402 chip ~ L12×W12×T6.5.
8 nozzle head (equipped with 2 cantilevers): The placement speed is 43000cph (0.084s/chip), the placement accuracy (Cpk≧1) is ±30μm/QFP 12mm~32mm, ±50μm/QFP 12mm or less, and the component size (mm) that can be placed is 0603 chip~L100×W90×T28.
2 nozzle heads (equipped with 2 cantilevers): The mounting speed is 11000cph (0.327s/chip), IPC9850 can reach 8500cph (0.423s/QFP); the mounting accuracy (Cpk≧1) is ±40μm/chip, and the mountable component size (mm) is 0402 chip ~ L6×W6×T3.
Component supply: The width of the braid is 8, 12, 16, 24, 32, 44, 56mm, and the maximum number of 8mm braids can reach 68 (when using 8mm thin single-type material rack and double-type braid material rack, small reel); the maximum number of rod-shaped elements is 8; the maximum number of trays is 20 (1 tray feeder).
Application fields of Panasonic NPM-D module high-speed placement machine
Consumer electronics: including mobile phones, tablets, laptops, digital cameras, smart watches, etc.
Household appliances: production of circuit boards for various household appliances such as televisions, stereos, air conditioners, refrigerators, etc.
Automotive electronics: manufacturing of control systems, entertainment systems, safety systems and other related electronic components in automobiles.
Communication equipment: network communication equipment such as routers and switches.
Industrial control equipment: used for circuit board mounting of various controllers, sensors and other equipment in the field of industrial automation.
Medical electronic equipment: production of electronic control parts in various medical devices.
Aerospace and military electronics: This chip mounter may also be used in the manufacture of some electronic equipment in the aerospace and military fields.
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