Panasonic DT401-MF Multi-function Mounter
parameter | DT401-M (KXF-E53C) | DT401-F (KXF-E64C) |
---|---|---|
Substrate size | L 50mm×W 50mm to L 330mm×W 250mm | L 50mm×W 50mm to L 510mm×W 460mm |
Mounting beat | 0.7s/chip (taping, bulk); 0.8s/QFP (single tray); 1.2s/QFP (double tray) | 0.7s/chip (taping, bulk); 0.8s/QFP (single tray); 1.2s/QFP (double tray) |
Mounting accuracy | ±50μm/chip (cpk>1), ±35μm/QFP (Cpk>1) | ±50μm/chip (cpk>1), ±35μm/QFP (Cpk>1) |
Component size | 1005 chip to L100mm×W90mm×T25mm | 1005 chip to L100mm×W90mm×T25mm |
Substrate replacement time | 2.0s | 0.9s (substrate length less than 240mm) |
power supply | Three-phase AC200 – 400v, 1.7kVA | Three-phase AC200 – 400v, 1.7kVA |
Air pressure source | 0.49MPa, 150L/m (ANR) | 0.49MPa, 150L/m (ANR) |
Equipment size | W 1260mm×D 2512mm×H 1430mm | W 1260mm×D 2722mm×H 1430mm |
weight | 1400KG | 1560KG |
Features of Panasonic DT401-MF Multi-function Mounter
High-precision placement:The mounting accuracy reaches ±50μm/chip (cpk>1), ±35μm/QFP (Cpk>1), which can ensure that electronic components are accurately mounted on the PCB and improve product quality.
Wide range of component applicability:It can mount components from 1005 chips to L100mm×W90mm×T25mm, including small chips to larger BGA, CSP, connectors, etc., to meet diverse production needs.
Efficient placement speed:The placement cycle is 0.7s/chip (taping, bulk), 0.8s/QFP (single tray), and 1.2s/QFP (double tray), which helps to improve production efficiency and shorten production cycle.
Flexible substrate size adaptability: The DT401-M model can adapt to substrate sizes from L 50mm×W 50mm to L 330mm×W 250mm, and the DT401-F model can adapt to substrate sizes from L 50mm×W 50mm to L 510mm×W 460mm, providing convenience for the production of circuit boards of different specifications.
Modular design:The modular design facilitates maintenance and upgrades, reducing equipment maintenance costs and downtime.
High stability:The structural design and manufacturing process of the equipment ensure its stability during long-term operation, reduce the probability of failure and improve the reliability of the equipment.
Easy to operate:With a friendly human-machine interface and operation control system, operators can easily get started, reducing training costs and time.
Consumer Electronics: Circuit boards used to produce various consumer electronic products such as mobile phones, tablets, smart watches, headphones, etc.
Computer and peripheral equipment:Including circuit board manufacturing for desktop computers, laptops, servers, and peripheral equipment such as printers and scanners.
vehicle electronics: Production of electronic components such as control systems, instrument panels, audio systems, navigation systems, etc. in automobiles.
Industrial Electronics:Circuit board patches for industrial automation equipment, instruments, sensors and other products.
communication device:Such as circuit board assembly of equipment such as routers, switches, communication base stations, etc.
Medical Electronics:Production of circuit boards for medical equipment, such as electrocardiographs, blood pressure monitors, blood glucose meters, etc.
Aerospace Electronics: In the aerospace field, this placement machine can be used to manufacture electronic components for aircraft, satellites and other equipment, which have high requirements on product reliability and precision.
Smart Appliances:Production of circuit boards for various smart home appliances, such as smart TVs, smart refrigerators, smart air conditioners, etc.
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