Fuji XP series placement machine model XP143
Mounting speed: 0.165 seconds/piece (rectangular component), equivalent to 21,800 pieces/hour; 0.180 seconds/piece (0402 object component), equivalent to 20,000 pieces/hour.
Mounting accuracy: ±0.050mm (cpk≧1.00, rectangular components, etc.); ±0.040mm (cpk≧1.00, QFP, etc.).
Component range: It can mount components from 0402 (01005) very small chips to 25×20mm, with a maximum height of 6mm. It can also mount BGA and CSP components (maximum 20×20mm) through options.
| parameter | Specification |
|---|---|
| Patch range | It can mount 0402 (in01005) – 25×20mm, parts with a height of less than 6mm, and can mount BGA and CSP through options |
| Mounting speed | 0.165 sec/pc, 21,800 pcs/hr (rectangular components); 0.180 sec/pc, 20,000 pcs/hr (0402 components) |
| Mounting accuracy | ±0.050mm (cpk≧1.00, rectangular components, etc.); ±0.040mm (cpk≧1.00, QFP, etc.) |
| Applicable substrate | Maximum size is 457×356mm, minimum size is 50×50mm, thickness is 3 – 4.0mm |
| Component Type | Maximum 100 types (50 types each for the front and rear sides) |
| Board loading time | 4.2 seconds |
| Rack support | Front and rear feeding, a total of 100 stations, trolley material change method, optional single-seat tray feeder |
| Machine size | Length 1500mm, width 1300mm, height 1408.5mm (excluding signal tower) |
| Machine weight | About 1800KG (main body) |
| language support | Chinese, English, Japanese |
| Programming | Supports both online programming and offline programming |
Mounting capability: It can mount extremely small chips of 0402 (01005), and can also mount BGA, CSP, etc. through options; it can handle components with a maximum size of 25×20mm and a maximum height of 6mm; it has a fast mounting speed and can mount rectangular components up to 21,800 pieces/hour (0.165 seconds/piece).
Feed tray platform and suction nozzle: Equipped with a single tray platform and automatic nozzle changer, it supports 100 types of components (50 on the front and 50 on the rear); it has a delivery side buffer function and a non-exhaust patch function, and supports trial production.
Circuit board processing：The maximum size of the electronic board is 457×356mm and the minimum is 50×50mm; the thickness of the electronic board supports 3 to 4.0mm.
Accuracy：The mounting accuracy is relatively high, and the rectangular components can reach ±0.050mm (cpk≧1.00), and the QFP components can reach ±0.040mm (cpk≧1.00).
Machine Specifications: The machine dimensions are 1,500mm long, 1,300mm wide, and 1,408.5mm high (excluding the signal tower); the machine weight is approximately 1,800KG (main body).
Application areas of Fuji XP143
Consumer electronics manufacturing, such as mobile phones, tablets, smart watches, etc., usually contain a large number of small electronic components that require high-precision and high-speed placement.
Computer and peripheral equipment production, including chip processing of computer motherboards, graphics cards, sound cards and other components.
Communication equipment manufacturing, such as electronic component mounting in routers, switches and other equipment.
In the field of automotive electronics, it is used for the production of automotive control systems, entertainment systems and other related electronic components.
Industrial control equipment production involves circuit board patches in various industrial automation equipment.
This chip placement machine is also used in the manufacturing of medical devices and the production of some medical electronic equipment.
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