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Fuji XPF-L High-Speed Multi-Purpose Mounter – Advanced SMT Placement Solution

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  • The Fuji XPF-L is an advanced pick-and-place machine designed to provide high-speed placement for SMT (Surface Mount Technology) applications. Featuring dynamic head exchange and capable of handling a wide range of components, it is a versatile solution for both high-volume production Und flexible small-batch manufacturing.
  • Hauptmerkmale:
    • Dynamic Head Exchange: The world’s first SMT machine to offer dynamic head exchange, allowing quick switching between high-speed and multi-purpose heads to optimize placement speed and accuracy.
    • High-Speed Performance: Capable of placing components with fine pitch at high speeds, making it ideal for complex assemblies and high-volume production lines.
    • Flexible Component Handling: Supports a wide variety of component sizes and types, making it suitable for a range of industries including Elektronikfertigung, automotive Und consumer electronics.
    • User-Friendly Interface: The intuitive user interface simplifies setup and operation, minimizing downtime and increasing overall productivity.
    • Reliability and Durability: Designed for longevity and consistent performance, the XPF-L ensures minimal maintenance and downtime.
  • Applications: The Fuji XPF-L is ideal for companies that require high-precision Und speed in their SMT production lines, such as those in the electronics Und automotive industries, as well as companies dealing with complex and fine-pitch components.
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技术规格 参数
対象电路板尺寸（L×B） MAX457mm×356mm
厚度 0,4 (0,3) – 5,0 mm/MIN50 mm × 50 mm
电路板载入时间 1,8 Sek.
Abmessungen (L x B x H) 1.500 mm × 1.607,5 mm × 1.419,5 mm
机器重量 Gewicht: 1.500 kg, MFU-40: 240 kg, BTU-AII: 120 kg, BTU-B: 15 kg, MTU-AII: 615 kg ）
吸嘴数 12 (nicht jugendfreie Version)
自动更换头收藏数 2
对象元件 0402(01005)～20×20mm, DurchmesserMAX3,0mm
贴装节拍 0,144 Sek./Stunde, 25.000 Cph
贴装精度 小型芯片元件片±0,050mm cpk≧1,00～±0,066mm cpk≧1,33, QFP元件±0,040mm cpk≧1,00～±0,053mm cpk≧1,33

Andere XPF-Dateimanager

自动更换贴装工作头:可以在生产中自动更换贴装工作头,实现了世界领先的自动更换工作头.因为可以在机器运转中从高速工作头自动更换为多功能工作头着剂的工作头, 仅用 1 台机器就可以进行涂敷胶着剂和贴装元件。

消除高速机和多功能机的界限:通过实现自动更换工作头，消除了高速机和多功能机的界限（无边界）.对于所有电路板种类,因为机器间的平衡始终处于较优状态,所以可以较大限度地发挥机器的能力。

高精度贴装: ± 0,050 mm cpk ≧ 1,00 ± 0,066 mm cpk ≧ 1,33, QFP 元件 ± 0,040 mm cpk ≧ 1,00 ± 0,053 mm cpk ≧ 1,33.

高生产效率: Geschwindigkeit von 0,144 Sek./h, 25.000 cph.

Vernetzte Computer: 0402(01005)～20×20mm, max. 3,0mm max.Verstellbare Schultergurte:支持料带元件（JIS 规格、JEITA）、料管元件、料盘元件等多种包装形式。

富士 XPF 贴片机的应用领域

富士 XPF 贴片机主要应用于表面贴装技术（SMT）生产线, 能够高速、高精度、全自动地贴放各种电子元件, 如芯片, 电阻, 电容, 连接器等, 具体应用领域包括但不限于以下几个方面:
消费电子:如手机、平板电脑、笔记本电脑、数码相机等。
汽车电子:如汽车导航系统、汽车音响、汽车安全系统等。
工业控制:如工业自动化设备、仪器仪表、医疗器械等。
通信设备:如路由器、交换机、基站等。
航空航天:如卫星、飞机等航空航天设备。

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