SIPLACE D2 High-Speed and Flexible SMT Pick and Place Machine

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The SIPLACE D2 is a high-speed, flexible SMT pick-and-place machine equipped with two gantries Und 12-nozzle Collect&Place heads, ideal for high-volume production Und flexible manufacturing. With the ability to handle small components (as small as 01005) and support dual gantry systems, the SIPLACE D2 ensures precise and rapid placement, making it perfect for electronics manufacturers requiring flexibility and speed. Whether you’re dealing with high-mix or high-volume production, this machine delivers outstanding performance at an optimal price-to-performance ratio.

  • Hauptmerkmale:
    • Dual Gantry System: Features two gantries to enhance speed Und flexibility, making it suitable for a wide range of production volumes.
    • High Precision: Capable of placing components as small as 01005 with precision placement.
    • Synchronized 12-Nozzle Heads: High-speed, synchronized heads achieve optimal throughput with reduced cycle times.
    • Versatile Application: Perfect for high-mix or low-volume, as well as high-volume production environments.
  • Applications: Ideal for electronics manufacturers looking for flexibility in handling diverse production runs, including consumer electronics, automotive, and telecommunications sectors. Its ability to manage high-mix, high-volume production with excellent precision makes it a versatile choice for companies that require both speed Und flexibility.
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参数 Bewertung
贴片速度 Die Zahl liegt bei 40.500 CPH, die IPC bei 27.200 CPH
贴片精度 ±50μm, ±0,225° bei 3δ
元件范围 01005″-200x125mm
PCB-Schaltplan Größe: 50 x 50 x 610 x 508 mm, Größe: 50 x 50 x 610 x 430 mm
PCB-Bauteile Durchmesser: 0,3 bis 4,5 mm
供料量 90°-8-mm-Lauffläche
Abonnieren ≥ 99,951 TP3T, DPM ≤ 0,011 TP3T
设置供电 200/208/230/380/400/415 VAC ± 51 TP3T, 50/60 Hz
Beispiel 5,5 bar (0,55 MPa) - 10 bar (1,0 MPa)
Anzahl der Zeichen (x x x Zeichen) 1587x2565x1980mm
重量 2343 kg (ca. 2 Monate)

Siemens SIPLACE D2 西门子贴片机的特点

  • 高速贴片: Der Preis beträgt 40.500 CPH, der IPC beträgt 27.200 CPH.
  • 高精度贴装: ± 50 μm, ± 0,225 ° bei 3 δ.
  • 元件范围广:可贴装01005″至200x125mm的元件。
  • PCB-Leiterplattenmontage: 50 x 50 x 610 x 508 mm, 50 x 50 x 610 x 430 mm für Leiterplattenmontage.
  • Vergrößern:拥有90条8mm料轨的供料量,能满足不同生产需求.
  • 高可靠性: ≥ 99,951 TP3T, DPM ≤ 0,011 TP3T.
  • 易于操作和维护:采用先进的控制系统和软件,操作简便,同时具备自动校正和故障诊断功能,方便设备维护.
  • 节能环保:设备在运行过程中能耗低,符合环保要求。

Siemens SIPLACE D2 西门子贴片机的应用领域

Siemens SIPLACE D2具体如下:

消费电子产品:可贴装智能手机、平板电脑、穿戴设备等产品中的各种元件。

汽车电子:适用于汽车电子模块、控制单元等的生产.

工业控制:能够满足工业控制系统中电路板的贴装要求.

医疗设备:在医疗设备的生产中,可精确贴装各种电子元件.

LED-Beleuchtung: 可以高效地贴装 LED 灯珠等元件

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