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FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
  1. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
  2. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly
  3. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly

FUJI NXT M6III Pick and Place Machine – High-Speed, Modular SMT Solution for Precision Assembly

$1.00

  • The FUJI NXT M6III is a highly efficient Bestückungsautomat designed for high-speed SMT assembly. It features cutting-edge modular design, advanced vision systems, and the latest high-speed head modules for improved productivity Und precision placement in surface mount technology.
  • Hauptmerkmale:
    • Modular Design: Easily adaptable to various production needs, maximizing flexibility and scalability.
    • High-Speed XY Manipulator: Provides fast and accurate component placement, achieving up to 37,500 CPH (chips per hour).
    • Advanced Camera Systems: The newly developed Fixed On-the-fly camera improves component alignment and inspection.
    • Dual Track Feeder System: Enhances feeding capacity and speeds up the assembly process, ensuring continuous production flow.
    • CE Certified: Meets international standards for safety and quality.
  • Applications: Ideal for high-volume, high-precision Elektronikfertigung Und SMT production lines, including those focused on high-density components.
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参数 Beschreibung
贴片速度 Lichtstärke: 0,43 µg/µl, 8370 µg/µl; IC-Wert: 0,56 µg/µl, 6420 µg/µl
贴装精度 矩形元件等: ±0,050 mm cpk ≥ 1,00; QFP 等: ± 0,040 mm cpk ≥ 1,00
元件范围 0603-45 mm × 150 mm
PCB-Leiterplatte Abmessungen: 48×48~510x534mm; Abmessungen: 48×48~610x534mm
进板速度 Dauer: 0 Sek.; Dauer: 3,4 Sek
料架支持 M3II: 20 µm (ca. 8 mm µm); M6II/M6IISP: 45 µm (ca. 8 mm µm)
机器尺寸 M3II Abmessungen: 740 L × 1934 B × 1474 mm H; M6II Abmessungen: 1390 L × 1934 B × 1476 mm H
机器重量 Gewicht 1800Kg
气压要求 0,5 MPa (5 kgf/cm2), 10 NL/Min
电压要求 3P/200V/10KVA
Übersetzung für "支持" im Deutsch 中、英、日等 7 种语言
操作系统 Windows-Softwareupdater
程序编辑 同时支持在线编程与脱机编程

富士 XP243 贴片机的特点

  • 高精度: ± 0,050 mm.
  • 高速贴片:贴片速度快,每小时可贴装8.370个矩形元件。
  • 多功能:可贴装从0603（0201）芯片到45mm×150mm的元件,范围广泛.
  • 紧凑设计:机器结构紧凑，占用空间小。
  • 操作方便:支持中、英、日等多种语言，操作界面友好。
  • 灵活配置: 可根据生产需求自由组合贴装工作头、元件供应单元和搬运轨道等单元. FUJI NXT M6III Pick and Place Machine - High-Speed, Modular SMT Solution for Precision Assembly

富士 XP243 贴片机的应用领域

富士 XP243 贴片机主要应用于电子信息制造业, 包括消费电子制造业、汽车电子制造业、通信设备制造业等行业,以下是一些具体应用领域:
消费电子:贴片机可用于生产手机、平板电脑、笔记本电脑、数码相机等消费电子产品。
汽车电子:在汽车电子领域,贴片机被广泛应用于生产汽车电子控制单元、仪表盘、导航系统等.
通信设备:贴片机可用于生产通信基站、路由器、交换机等通信设备的电子组件。
工业控制:在工业自动化领域,贴片机可用于生产工业控制设备、机器人、传感器等的电子组件.
Chinesische Medizin:贴片机可用于生产医疗设备、医疗器械等的电子组件.

 

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