TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
Features
Specifications
Downloads
Fast SMT Parts RFQ
Send this product to BuySMT. Please include quantity, machine model, delivery country, and photos if the part number is unclear.
• High Speed 2D + 3D Inspection of Up to 01005 Components
• High Defect Coverage Using Hybrid 2D + 3D Inspection Technology
• True 3D Profile Measurement Using Dual Laser Units
• Intelligent Rapid Programming Interface with Auto Library and Offline Editing
| Imaging Method | Dynamic Imaging with true 3D profile measurement |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm |
| Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 µm |
| Max PCB Size | TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
| WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1630 x 1655 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg |